MediaTek is gearing up to release its latest mid-range chipset, the Dimensity 8300, on November 21. The announcement comes after months of anticipation and speculation surrounding the chipset’s specifications and performance.
The Dimensity 8300 is expected to be a powerful and affordable option for smartphone manufacturers and consumers alike. It is rumored to feature a 1+3+4 architecture with ARMv9 cores, similar to the Dimensity 9300, but with slightly toned-down cores and clock speeds. The chipset is also expected to feature a Mali G52 MC6 GPU and support for 5G connectivity.
Here are some of the expected specifications of the Dimensity 8300:
- CPU: 1x Cortex-X3 @ 2.8GHz + 3x Cortex-A715 @ 2.4GHz + 4x Cortex-A510 @ 1.6GHz
- GPU: Mali G52 MC6 @ 850MHz
- Process: TSMC N4P4nm
The Dimensity 8300 is expected to be a major competitor to Qualcomm’s Snapdragon 7+ Gen 2. With its impressive specifications and competitive pricing, the Dimensity 8300 is sure to be a popular choice among smartphone manufacturers and consumers alike.
We will keep you updated on the latest news about the Dimensity 8300. In the meantime, be sure to check out our coverage of the Dimensity 9300 to get an idea of what to expect from the 8300.
- The Dimensity 8300 is expected to power a range of mid-range smartphones from various manufacturers.
- With its impressive performance and advanced features, the Dimensity 8300 is poised to make a significant impact in the mid-range smartphone market.
- The Dimensity 8300 is shaping up to be a formidable contender in the mid-range chipset market.